BURN IN BOARD DESIGN



  • Suitable to be used in hast environment
  • Leakage or shorting in hast environment is prevented by a layer of conformal coating
  • High temperature board materials are used to prolong the life span of the board
  • 4 – 8 layers design

  • Suitable to be used in high or ambient temperature environment
  • Real time monitoring burn-in
  • Signal trace impedance is controlled typically at 75Ω
  • 6 – 12 layers design
  • Signal termination and daisy chain routing are designed to maintain signal integrity
  • Board materials are used to prolong the life span of the board

  • Suitable to be used in high temperature environment
  • Dynamic burn-in where signals are pumped in to stress the DUT
  • 6 – 10 layers design
  • Signal trace impedance is controlled typically at 50Ω
  • High temperature board materials are used to prolong the life span of the board


  • ESD or latch up board
  • All the signals trace are having the same propagation delays


  • Logic Sequencer address generator
  • Customize pattern address generator
  • Able to support address from A0 to A38
  • 0.5A Output pulse current per channel
  • Suitable to be used as memory device burn in driver board