MPM Hi-E Solder Printer

Flexi Mounter

Chip Shoote

Reflow Oven

Off-Line AOI

Off-Line Vacuum Vapor Phase Reflow


  • X-ray Report
  • Inspection Report
  • Testing Certification
  • 8D Report

  • Highly skilled production staffs and leaders
  • Strategic factory location (vicinity to MNC & SMI factories)
  • Adequate quality control measures and monitoring
  • SMT assembly line is capable of handling 0201, fine pitch 0.3mm BGA, flexible PCB
  • Innovated process to achieve reduction in manpower cost and production time with consistent quality
  • Lead-Free & RoHS compliance

LED Emitter attachment to MCPCB Convention Reflow

Cepco’s Vacuum Reflow

LCC with thermal pad attachment to PCB
Innovative solution for the lowest solder void formation